Dedicated NPI lines and resources

Quotation in 24-48 hours

Layout design (Cadence Allegro, Altium Designer)

Design for Fabrication (DFF)

Design for Manufacturing (DFM, Valor)

Component Lifecyle and Environmental study

Mechanical development 

Tooling review

CAD review and conversion

Automated test equipment

BOM scrub and long lead time component analysis within 48hours

Established supply chain of quick turn PCBs suppliers

Flexible and responsive Program Management support

Lead-free, Tin-lead, No-clean, Water soluble

Smallest component size placements:

• 01005, 0.3mm micro BGA​

Largest BGA size: 60mmx60mm​

Flex, rigid-flex (Min thickness: 0.005”)

10 zone Reflow oven

Semi-automated through-hole insertion

Wave and selective soldering

DI water wash (in line, automated)

Saponifier (batch, automated)

5 tons press fit

Depanelizing (automated)

Production floor tracking and process controls

Component traceability

Conformal coating

Encapsulation/dispensing

Custom shipping corrugated boxes

Custom cable design and assembly

Harnesses, micro HDMI, micro-axial

Reverse engineering

Material recommendations

Wire stripping, splicing, crimping

Electrical and wire pull-test

Quick turn cable prototypes in-house

Mass production capabilities

Solder paste inspection (SPI)

Automated optical inspection (AOI)

3D X-ray (oblique angles, slices)

CMM at 01.mil (2.5um) accuracy

ESS Burn-In, HALT/HASS 

• -100 °C to 200 °C, 70 °C/min, repetitive shock and vibration​

Test fixture development and design

System integration functional testing

IPC610 Trainer on site